Semi Auto Aligner Station
Rotate 270 deg
Semi-auto Alignment Machine Spec. Card Platform : 350mm x 290mm Vacuum Chuck : D 180mm.
Chuck Surface Precision: 0.01mm Z-Stroke: 50mm.
Dimensions: 450mm(W) x 340mm(H) x 450mm(D) Weight : 50kg
Vacuum Pressure: Depending on the chosen vacuum pump
Pipe Joint : ∮ 4 mm
Light source power : 110V
Fuctions:
Through the adjustments of X,Y,Z, θ positions, the user can align the needles with the MASK or the PAD of wafer correctly.
Can align forward or backward according to the product property or the habit of the operator.
User friendly control interface, easy to learn. (Can be controlled by touch panel or hand wheel.)
Additional pedal switch allows the operator to operate with both hands at the same time and increase the stability of operation.
Total CHUCK TOP travel: 50 mm; Resolution: 1.0 μm
With fast-positioning button to do OVERDRIVE, TOUCH DOWN and HOME fast-positioning. It’s convenient for repeat operation and probe-card loading and unloading.
